Lam Research 810-102361-222 Chamber MUX PCB Assembly

Original price was: $2,970.00.Current price is: $2,530.00.

  • Model: 810-102361-222 (Assembly PN: 855-102361-222)
  • Brand: Lam Research
  • Series: Alliance / 2300 / Kiyo / Exelan Series Etch Platforms
  • Core Function: Multiplexes multi-channel sensor signals and chamber telemetry back to the main tool controller.
  • Product Type: Chamber MUX (Multiplexer) PCB Assembly
  • Key Specs: Multi-Channel Analog/Digital MUX | High-Density Backplane Connector | Low-Noise Signal Conditioning
  • Condition: New Surplus / Factory Sealed (Condition: Tested Refurbished Available)
Brand: Model/SKU: 810-102361-222

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Description

Product Introduction

The Lam Research 810-102361-222 is a dedicated Chamber Multiplexer (Chamber MUX) circuit board assembly designed for distributed signal aggregation within Lam semiconductor manufacturing equipment. Installed across 200mm and 300mm dry etch platforms—including Alliance, 2300, and Kiyo systems—this card consolidates multiple analog and digital inputs from chamber-level sensors, mass flow controllers, temperature probes, and pressure transducers into unified high-speed telemetry lines.

In harsh plasma etch environments, routing dozens of individual raw sensor cables back to the main chassis causes signal degradation and severe ground loop interference. The 810-102361-222 resolves this by localizing the signal multiplexing directly at the chamber rack. Its precision filtering circuitry isolates weak sensor signals from heavy RF noise generated by plasma power supplies, ensuring stable data execution during critical process steps.

 

Key Technical Specifications

Parameter Value
Manufacturer Lam Research
Board Part Number 810-102361-222
PBA / Assembly Part Number 855-102361-222
Board Function Chamber Signal Multiplexer (Chamber MUX)
Tool Compatibility Lam 2300, Kiyo, Exelan, Alliance Series
Operating Voltage 24V DC Internal Rack Power / Logic Auxiliary
Signal Processing Type High-Density Multi-Channel Analog/Digital Multiplexing
Form Factor Multi-Layer PCB / Plug-in Backplane Card
Operating Environment 0°C to +55°C (Internal Tool Card Cage)

 

Application Scenarios & The “Trench” Experience

Picture this: You are managing a 300mm etch bay during a critical production run when Chamber 3 triggers a catastrophic “Chamber Telemetry Timeout” error mid-recipe. The tool halts, dumping a batch of high-value production wafers. Swapping individual baratron pressure sensors and temperature controllers fails to clear the fault; the real issue is a degraded solid-state multiplexer chip on the Chamber MUX board. When signal channels fail on this card, the main controller loses visibility into chamber conditions and aborts the run automatically to prevent catastrophic wafer damage.

  • Plasma Etch Chambers (Kiyo / 2300 Series) – Multiplexes real-time readings from electrostatic chuck (ESC) temperature loops, chamber wall thermocouples, and pressure manometers.
  • Gas Box & Distribution Panels – Aggregates high-density analog signals from multiple mass flow controllers (MFCs) before sending digitized feedback to the host CPU.
  • Process Diagnostics & Endpoint Sensing – Maintains clean signal lines for optical emission spectroscopy (OES) interfaces without RF coupling.

Field Replacement Case: A semiconductor facility in Idaho encountered intermittent sensor drift and random recipe aborts on an Alliance C upgraded tool. Thermal imaging identified a failing analog driver on the old Chamber MUX card. Swapping the assembly with a fully bench-tested 810-102361-222 unit restored clean, noise-free telemetry in under 35 minutes, eliminating unscheduled tool downtime before the shift ended.

 

Transparency SOP: Quality Assurance & Testing

We don’t just ship boxes; we test them on actual bench setups before signed clearance:

  1. Inbound Visual Inspection: Inspect under high magnification for PCB micro-cracks, trace delamination, connector pin corrosion, or burnt surface-mount passives.
  2. Power Rail & Thermal Check: Supply 24V DC bench power to monitor quiescent current draw and scan for leaky capacitors or hot spots via FLIR thermal imaging.
  3. Multiplexer Switching Tests: Drive test signals through all analog and digital input channels to verify channel-to-channel switching speed and cross-talk suppression.
  4. Signal Waveform Integrity: Verify output line drivers on an oscilloscope to confirm zero signal distortion and proper amplitude thresholds under load.
  5. Anti-Static Packaging: Flush multi-pin backplane connectors with contact cleaner, pack the card in an anti-static ESD shield bag, and suspend it inside custom high-density foam shipping containers.
810-102361-222

810-102361-222

810-102361-222

810-102361-222

The Veteran’s Tech Trap Guide (Crucial Value-Add)

  • ⚠️ Confirm Suffix Compatibility: Pay close attention to the suffix revision (e.g., -222 vs. -216 or -223). Lam periodically modifies onboard multiplexer ICs, address decoding logic, or gain stages. Installing an incorrect suffix revision can cause mismatched analog scaling factors in software.
  • Never Hot-Swap Backplane Cards: Pulling an 810-102361-222 card while the tool’s 24V DC backplane power is live can create inductive arc spikes across dense connector pins. Always de-energize power to the target card cage before removal or installation.
  • ⚠️ Check Backplane Pin Alignment: The multi-pin DIN connectors on these MUX boards can bend easily if inserted at an angle. Never force the board into the slot; align the card guide rails carefully and push straight in using even pressure on the card ejectors.
  • Verify RF Noise Grounding: If you experience ghosting or signal noise on newly installed MUX cards, check the card cage mounting screws and chassis ground straps. Corroded or loose chassis grounds allow stray RF from the match network to bleed directly into analog sensor channels.

 

Frequently Asked Questions (FAQ for Conversion)

Q: Is the 810-102361-222 board hot-swappable?

A: No. Extracting this card while power is applied can damage backplane edge connectors and trigger voltage transients across adjacent cards. Shut down DC power to the target bay cabinet prior to replacement.

Q: What is the difference between part number 810-102361-222 and 855-102361-222?

A: The 810- prefix typically denotes the bare PCB or unpopulated/sub-assembly level number, whereas the 855- prefix designates the complete, fully populated top-level PCB assembly (PBA) ready for tool installation.

Q: Does this card require field calibration or firmware flashing?

A: Generally, no firmware flashing is required on the board itself. Once physically seated in the correct slot, the tool’s host controller automatically initializes the multiplexer logic upon system boot.

Q: Why buy Surplus or Refurbished stock over ordering directly from the OEM?

A: OEM lead times for legacy 200mm/300mm etch components can stretch for weeks or months. Our pre-tested surplus stock ships immediately, allowing you to restore tool operation without waiting on factory production cycles.

Q: What warranty comes with this module?

A: We back all our 810-102361-222 units with a full 12-month replacement warranty. If the card fails under normal operational conditions within 365 days of purchase, we will replace it or issue a full refund.