Description
Core Product Summary (Brand / Model / Key Attributes)
The Gespac GESOUT-3 OUT-3B (also referenced as GESOUT-3B) is a digital output module and circuit card assembly designed for industrial automation systems. It functions as a 32-channel industrial output module that interfaces control logic with field devices.
Manufactured by Gespac, the module is used in specialized equipment such as EVG semiconductor processing systems (mask aligners, wafer bonders, and coater/developers of vintage configurations) and deep-sea intervention systems. It operates as part of modular I/O architectures, typically under OS-9 or compatible real-time operating environments, providing discrete switching capability for actuators, solenoids, and indicators.
Key Technical Specifications
| Parameter | Value |
|---|---|
| Manufacturer | Gespac |
| Model / Order Number | GESOUT-3 OUT-3B / GESOUT-3B |
| Product Type | Digital Output Module / Circuit Card Assembly |
| Function | 32 Industrial Output Module |
| NSN | 5998-01-510-4798 |
| Primary Applications | Semiconductor equipment (EVG systems), deep-sea intervention systems |
| Form Factor | Circuit card / plug-in module |
Detailed Product Overview
The Gespac GESOUT-3 OUT-3B is a dedicated industrial output interface board that converts control signals from a host system into discrete output actions. As a 32-channel industrial output module, it serves as the actuation layer in automated control architectures, enabling the host controller to switch field devices such as relays, contactors, valves, or indicator circuits.
In semiconductor manufacturing equipment from EVG (including older models of the 640 mask aligner, 520/850 wafer bonders, and 150/160 coater/developer systems), the module appears as a GESPAC OS-9 output card (sometimes referenced under the ACB-GESOUT-3B designation). It provides the necessary digital switching points for process sequencing and peripheral control within these machines.
The same part number is documented in deep-sea intervention systems, indicating suitability for demanding environmental and reliability requirements. The board is designed as a circuit card assembly that installs into a compatible backplane or chassis, following Gespac modular I/O conventions of its era.
Because detailed electrical ratings (voltage, current per channel, isolation type) are configuration-specific and not universally published in open manufacturer literature for this exact suffix, selection and integration should be based on the original system documentation or verified board markings.
Engineering Selection Highlights
- Identified as a 32-channel industrial output module, suitable for multi-point discrete control in legacy automation systems.
- Documented use in EVG semiconductor process equipment provides a clear form-fit-function reference for maintenance and replacement.
- Circuit card assembly format supports installation in Gespac-compatible chassis or OS-9 based controllers.
- NSN listing confirms recognition in specialized and military-adjacent applications (deep-sea intervention systems).
- Output function focuses on reliable switching of field devices rather than continuous analog control.
- Compatibility is system-specific; verify backplane, addressing, and firmware expectations of the host controller before substitution.
GESOUT-3 OUT-3B
GESOUT-3 OUT-3B
Dimensions, Mounting & Connection Notes
As a circuit card assembly, the module follows Gespac board outline and connector standards of its generation. Installation requires a matching backplane or card cage. Field wiring is typically routed through dedicated terminal blocks or system-specific harnesses. Exact mechanical dimensions and connector pinouts are defined in the original Gespac or equipment OEM documentation.
System Compatibility & Integration Requirements
| Item / Dependency | Verified Compatibility or Requirement | Practical Note |
|---|---|---|
| Host system | Gespac modular I/O architecture / OS-9 environments | Confirm bus interface and addressing |
| Equipment examples | EVG 640, 520, 850, 150, 160 series (older vintages) | Match exact revision and cable harness |
| Mounting | Circuit card / plug-in module | Requires compatible chassis or backplane |
| Function | Discrete digital outputs (32 channels) | Verify load type and isolation needs with original documentation |
FAQ
What is the Gespac GESOUT-3 OUT-3B?
It is a digital output module and circuit card assembly identified as a 32-channel industrial output module from Gespac.
Where is it commonly used?
It is documented in older EVG semiconductor equipment (mask aligners, wafer bonders, coater/developers) and in deep-sea intervention systems.
What is the NSN?
5998-01-510-4798.
Is it a relay or solid-state output module?
The exact output technology (relay versus solid-state) is configuration-dependent; consult the specific board revision and system manuals for confirmation.
How is it installed?
As a plug-in circuit card into a compatible Gespac chassis or backplane.
What operating system environments support it?
It is associated with OS-9 based control systems used in the referenced equipment.
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